首页> 外文OA文献 >Computer simulation of current transport in GaN and AlGaN Schottky diodes based on thin surface barrier model
【2h】

Computer simulation of current transport in GaN and AlGaN Schottky diodes based on thin surface barrier model

机译:基于薄表面势垒模型的GaN和AlGaN肖特基二极管中电流传输的计算机模拟

代理获取
本网站仅为用户提供外文OA文献查询和代理获取服务,本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文,但由于OA文献来源多样且变更频繁,仍可能出现获取不到、文献不完整或与标题不符等情况,如果获取不到我们将提供退款服务。请知悉。
获取外文期刊封面目录资料

摘要

This paper attempts a rigorous computer simulation of the current transport in GaN and AlGaN Schottky diodes on the basis of the thin surface barrier (TSB) model recently proposed by the authors’ group. First, a computer program was developed which can calculate current transport through an arbitrary potential profile of Schottky barrier by a combined mechanism of thermionic emission (TE), thermionic-field emission (TFE) and field emission (FE). Then, from the view point of the TSB model, attempts were made to fit the theoretical temperature dependent current voltage (I–V–T) curves to the measured I–V–T data taken on Ni/n-GaN and Ni/n-AlGaN Schottky diodes changing the barrier profiles and the energy depth of the surface donor. As compared with the previous poor fitting using approximate analytic formulas, excellent fitting was obtained for both forward and reverse current, confirming the validity of the TSB model as the mechanism for anomalously large leakage currents in GaN and AlGaN Schottky diodes. Best fittings for GaN and Al 0.26 Ga 0.74 N were obtained for exponentially decaying distributions of surface defect donors with the peak density of 5 × 10(18) cm(−3) and 1 × 10(19) cm(−3), the characteristic decay depth of 11 nm and 11.5 nm and the energy depth of 0.25 eV and 0.37 eV, respectively.
机译:本文基于作者小组最近提出的薄表面势垒(TSB)模型,尝试对GaN和AlGaN肖特基二极管中的电流传输进行严格的计算机仿真。首先,开发了一种计算机程序,该程序可以通过热电子发射(TE),热电子场发射(TFE)和场发射(FE)的组合机制来计算通过任意肖特基势垒的电流传输。然后,从TSB模型的角度出发,尝试将理论上与温度相关的电流电压(I–V–T)曲线拟合到Ni / n-GaN和Ni / n上测得的I–V–T数据-AlGaN肖特基二极管可改变势垒轮廓和表面施主的能量深度。与以前使用近似解析公式的较差拟合相比,正向和反向电流均获得了出色的拟合,从而证实了TSB模型作为GaN和AlGaN肖特基二极管中异常大的泄漏电流的机理的有效性。对于表面缺陷给体的指数衰减分布,峰值密度为5×10(18)cm(-3)和1×10(19)cm(-3),获得了GaN和Al 0.26 Ga 0.74 N的最佳拟合。特性衰减深度分别为11 nm和11.5 nm,能量深度分别为0.25 eV和0.37 eV。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
代理获取

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号